BOE buffered etch solution is a key chemical solution used in the semiconductor industry for precise control of silicon dioxide etching, mainly composed of hydrofluoric acid and ammonium fluoride. With its stable etch rate and excellent surface flatness, it is widely applied in processes such as precision etching of silicon dioxide, selective etching of silicon nitride, and MEMS and 3D IC manufacturing. This product features ultra-high purity, low particulate matter, and high precision in concentration control, and can meet customer formulation and high-quality requirements.