Post-chemical mechanical polishing cleaning is a critical step in semiconductor manufacturing, directly affecting device reliability and yield. It efficiently removes polishing particles, metal ions, and organics, while avoiding surface damage. There are robust cleaning solutions for copper/cobalt interconnects, acidic cleaning solutions for barrier layers/tungsten, and surfactant-enhanced cleaning solutions. This product features ultra-high purity, low particulate matter, and high precision in concentration control, and can meet customer formulation and high-quality requirements.